ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,761, issued on April 14, was assigned to Shanghai Tianma Micro-electronics Co. Ltd. (Shanghai). "LED display panel and display device with... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,762, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods and apparatus to reduce thickness of on-package memor... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,762, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods and apparatus to reduce thickness of on-package memor... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,763, issued on April 14, was assigned to OSRAM Opto Semiconductors GmbH (Regensburg, Germany). "Method for producing a plurality of compon... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,763, issued on April 14, was assigned to OSRAM Opto Semiconductors GmbH (Regensburg, Germany). "Method for producing a plurality of compon... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,764, issued on April 14, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device and method of fabricating the ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,764, issued on April 14, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device and method of fabricating the ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,765, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated passive device dies an... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,765, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated passive device dies an... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,766, issued on April 14, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Semiconductor package structure" was invented by Hsiao-Yun... Read More