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INTERNATIONAL PATENT: MURATA MANUFACTURING CO., LTD., 株式会社村田製作所, TOKYO UNIVERSITY OF SCIENCE FOUNDATION, 学校法人東京理科大学 FILES APPLICATION FOR "THERMALLY CONDUCTIVE COMPOSITION"

Posted On: 2026-04-19
Government News US Fed News Patentwipo

GENEVA, April 19 -- MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto6178555), 株式会社村田製作所 (京&#3711... Read More

INTERNATIONAL PATENT: NIPRO VASCULAR CORPORATION, ニプロバスキュラー株式会社 FILES APPLICATION FOR "INTRODUCER"

Posted On: 2026-04-19
Government News US Fed News Patentwipo

GENEVA, April 19 -- NIPRO VASCULAR CORPORATION (5th Floor, KDX Nagoya Sakae Building, 4-5-3 Sakae, Naka-ku, Nagoya-shi, Aichi4600008), ニプロバスキュラ&... Read More

INTERNATIONAL PATENT: NIPRO VASCULAR CORPORATION, ニプロバスキュラー株式会社 FILES APPLICATION FOR "CATHETER BALLOON AND METHOD FOR MANUFACTURING CATHETER BALLOON"

Posted On: 2026-04-19
Government News US Fed News Patentwipo

GENEVA, April 19 -- NIPRO VASCULAR CORPORATION (5th Floor, KDX Nagoya Sakae Building, 4-5-3 Sakae, Naka-ku, Nagoya-shi, Aichi4600008), ニプロバスキュラ&... Read More

INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "DISPLAY DEVICE, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE"

Posted On: 2026-04-19
Government News US Fed News Patentwipo

GENEVA, April 19 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1, Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソ&... Read More

INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "TWO-PART CURABLE ADHESIVE, LAMINATE AND RECYCLING METHOD"

Posted On: 2026-04-19
Government News US Fed News Patentwipo

GENEVA, April 19 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区&#2... Read More

INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "TWO-PACK CURABLE ADHESIVE, LAMINATE, RECYCLING METHOD"

Posted On: 2026-04-19
Government News US Fed News Patentwipo

GENEVA, April 19 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区&#2... Read More

INTERNATIONAL PATENT: SONY GROUP CORPORATION, ソニーグループ株式会社 FILES APPLICATION FOR "INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING SYSTEM"

Posted On: 2026-04-19
Government News US Fed News Patentwipo

GENEVA, April 19 -- SONY GROUP CORPORATION (1-7-1, Konan, Minato-ku, Tokyo1080075), ソニーグループ株式会社 (東京都&#... Read More

INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "PHOTODETECTOR AND ELECTRONIC DEVICE"

Posted On: 2026-04-19
Government News US Fed News Patentwipo

GENEVA, April 19 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1, Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソ&... Read More

INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD"

Posted On: 2026-04-19
Government News US Fed News Patentwipo

GENEVA, April 19 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahicho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソ&#1... Read More

INTERNATIONAL PATENT: SONY GROUP CORPORATION, ソニーグループ株式会社 FILES APPLICATION FOR "INFORMATION PROCESSING DEVICE AND METHOD"

Posted On: 2026-04-19
Government News US Fed News Patentwipo

GENEVA, April 19 -- SONY GROUP CORPORATION (1-7-1, Konan, Minato-ku, Tokyo1080075), ソニーグループ株式会社 (東京都&#... Read More