ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,735, issued on April 14, was assigned to GLOBALFOUNDRIES U.S. Inc. (Malta, N.Y.). "Device with airgap structure" was invented by Uppili S.... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,736, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Shield to reduce substrate electromagnetic interference and w... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,736, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Shield to reduce substrate electromagnetic interference and w... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,737, issued on April 14, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Electronic assembly comprising metal foil layer ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,737, issued on April 14, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Electronic assembly comprising metal foil layer ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,738, issued on April 14, was assigned to The Charles Stark Draper Laboratory Inc. (Cambridge, Mass.). "Systems and methods for providing d... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,738, issued on April 14, was assigned to The Charles Stark Draper Laboratory Inc. (Cambridge, Mass.). "Systems and methods for providing d... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,739, issued on April 14, was assigned to JCET STATS ChipPAC Korea Ltd. (South Korea). "Semiconductor device and method of forming a 3-D st... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,739, issued on April 14, was assigned to JCET STATS ChipPAC Korea Ltd. (South Korea). "Semiconductor device and method of forming a 3-D st... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,740, issued on April 14, was assigned to XILINX INC. (San Jose, Calif.). "Chip package with integrated embedded off-die inductors" was inv... Read More