ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,714, issued on April 14, was assigned to DISCO Corp. (Tokyo). "Lift-off method" was invented by Masato Terajima (Tokyo), Junya Mimura (Tok... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,715, issued on April 14, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan). "Isolation structure and memory device" was in... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,715, issued on April 14, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan). "Isolation structure and memory device" was in... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,716, issued on April 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Interconnect with two-dimensional free zer... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,716, issued on April 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Interconnect with two-dimensional free zer... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,717, issued on April 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure and method of manufact... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,717, issued on April 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure and method of manufact... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,718, issued on April 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Memory device and method of manufacturing the same" was ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,718, issued on April 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Memory device and method of manufacturing the same" was ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,719, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a through-via ... Read More