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INTERNATIONAL PATENT: SHARP KABUSHIKI KAISHA FILES APPLICATION FOR "METHOD AND APPARATUS FOR SUPPORTING ON-DEMAND INFORMATION IN WIRELESS NETWORKS"

Posted On: 2026-04-14
Government News US Fed News Patentwipo

GENEVA, April 14 -- SHARP KABUSHIKI KAISHA (1 Takumi-cho, Sakai-ku, Sakai City, Osaka5908522) filed a patent application (PCT/JP2025/034588) for "METHOD AND APPARATUS FOR SUPPORTING ON-DEMAND INFORMAT... Read More

INTERNATIONAL PATENT: NGK INSULATORS, LTD., 日本碍子株式会社 FILES APPLICATION FOR "TEMPORARY BONDING SUBSTRATE AND METHOD FOR MANUFACTURING TEMPORARY BONDING SUBSTRATE"

Posted On: 2026-04-14
Government News US Fed News Patentwipo

GENEVA, April 14 -- NGK INSULATORS, LTD. (2-56 Suda-cho, Mizuho-ku, Nagoya-shi, Aichi4678530), 日本碍子株式会社 (愛知県名&#21476... Read More

INTERNATIONAL PATENT: MURATA MANUFACTURING CO., LTD., 株式会社村田製作所 FILES APPLICATION FOR "WIRE-WOUND COIL COMPONENT"

Posted On: 2026-04-14
Government News US Fed News Patentwipo

GENEVA, April 14 -- MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto6178555), 株式会社村田製作所 (京&#3711... Read More

INTERNATIONAL PATENT: DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "SURFACE-TREATED SILICA POWDER, PACKAGE AND STORAGE METHOD"

Posted On: 2026-04-14
Government News US Fed News Patentwipo

GENEVA, April 14 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央... Read More

INTERNATIONAL PATENT: MISUMI CORPORATION, 株式会社ミスミ FILES APPLICATION FOR "SUPPORT SYSTEM, CONTROL METHOD AND SUPPORT PROGRAM"

Posted On: 2026-04-14
Government News US Fed News Patentwipo

GENEVA, April 14 -- MISUMI CORPORATION (6-5, Kudanminami 1-chome, Chiyoda-ku, Tokyo1028583), 株式会社ミスミ (東京都千代田&... Read More

INTERNATIONAL PATENT: DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "SURFACE-TREATED SILICA POWDER AND METHOD FOR PRODUCING SURFACE-TREATED SILICA POWDER"

Posted On: 2026-04-14
Government News US Fed News Patentwipo

GENEVA, April 14 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央... Read More

INTERNATIONAL PATENT: SUMITOMO ELECTRIC INDUSTRIES, LTD., 住友電気工業株式会社 FILES APPLICATION FOR "FUSION SPLICING DEVICE AND FUSION SPLICING METHOD"

Posted On: 2026-04-14
Government News US Fed News Patentwipo

GENEVA, April 14 -- SUMITOMO ELECTRIC INDUSTRIES, LTD. (5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka5410041), 住友電気工業株式会社 (&#2... Read More

INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "INK COMPOSITION FOR SOFT PACKAGING LAMINATES, PRINTED MATTER, LAMINATE, OR PACKAGE"

Posted On: 2026-04-14
Government News US Fed News Patentwipo

GENEVA, April 14 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区&#2... Read More

INTERNATIONAL PATENT: SONY GROUP CORPORATION, ソニーグループ株式会社 FILES APPLICATION FOR "DISPLAY SYSTEM"

Posted On: 2026-04-14
Government News US Fed News Patentwipo

GENEVA, April 14 -- SONY GROUP CORPORATION (1-7-1, Konan, Minato-ku, Tokyo1080075), ソニーグループ株式会社 (東京都&#... Read More

INTERNATIONAL PATENT: SONY GROUP CORPORATION, ソニーグループ株式会社 FILES APPLICATION FOR "IMAGE PROCESSING DEVICE AND METHOD AND PROGRAM"

Posted On: 2026-04-14
Government News US Fed News Patentwipo

GENEVA, April 14 -- SONY GROUP CORPORATION (1-7-1, Konan, Minato-ku, Tokyo1080075), ソニーグループ株式会社 (東京都&#... Read More