ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,527,246, issued on Jan. 20, was assigned to MICROSOFT TECHNOLOGY LICENSING LLC (Redmond, Wash.). "Deep learning system and method for predictin... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,527,337, issued on Jan. 20, was assigned to Red Bull GmbH (Fuschl am See, Austria). "Facility for producing an aqueous food product and its use... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,270, issued on Jan. 20, was assigned to NVIDIA Corp. (Santa Clara, Calif.). "Frequency adjustment for processors" was invented by Sreedhar ... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,318, issued on Jan. 20, was assigned to VIVO MOBILE COMMUNICATION Co. LTD. (Dongguan, China). "Transmission method and device" was invented... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,273, issued on Jan. 20, was assigned to GENERAL SILICONES Co. LTD. (Hsinchu, Taiwan). "Silicone elastomer, and manufacturing method thereof... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,393, issued on Jan. 20, was assigned to IQE plc (Cardiff, Great Britain). "Porous distributed Bragg reflector apparatuses, systems, and met... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,439, issued on Jan. 20, was assigned to Capital One Services LLC (McLean, Va.). "Using biometric behavior to prevent users from inappropria... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,238, issued on Jan. 20, was assigned to THE JAPAN STEEL WORKS LTD. (Tokyo). "Drive mechanism, injection apparatus, and injection molding ma... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,451, issued on Jan. 20, was assigned to Honda Motor Co. Ltd. (Tokyo). "Outer rotor motor with rotor attachment member" was invented by Naok... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,776, issued on Jan. 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package including SoI... Read More