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US Patent Issued to Hangzhou Geo-chip Technology on Sept. 1 for "RF front-end chip, RF switch module, and RF communication device" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,726,160, issued on Sept. 1, was assigned to Hangzhou Geo-chip Technology Co. Ltd. (Hangzhou, China). "RF front-end chip, RF switch module, and ... Read More


US Patent Issued to Qorvo US on Sept. 1 for "Differential amplifier with impedance terminations" (Massachusetts, New Hampshire Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,726,161, issued on Sept. 1, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Differential amplifier with impedance terminations" was invented... Read More


US Patent Issued to CIRRUS LOGIC on Sept. 1 for "Charge injection-related and switching error-related offset reduction by local chopping of switched-capacitor circuits" (Texas Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,726,163, issued on Sept. 1, was assigned to CIRRUS LOGIC INC. (Austin, Texas). "Charge injection-related and switching error-related offset red... Read More


US Patent Issued to AAC Technologies on Sept. 1 for "Amplifier circuit for microphone, microphone circuit and electronic device" (Singaporean Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,726,164, issued on Sept. 1, was assigned to AAC Technologies Pte. Ltd. (Singapore). "Amplifier circuit for microphone, microphone circuit and e... Read More


US Patent Issued to Skyworks Solutions on Sept. 1 for "Method of making acoustic wave devices with multi-layer piezoelectric substrate" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,726,165, issued on Sept. 1, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Method of making acoustic wave devices with multi-layer ... Read More


US Patent Issued to Skyworks Global on Sept. 1 for "Bulk acoustic wave device with piezoelectric layer formed by atomic layer deposition" (American, South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,726,166, issued on Sept. 1, was assigned to Skyworks Global Pte. Ltd. (Singapore). "Bulk acoustic wave device with piezoelectric layer formed b... Read More


US Patent Issued to AAC Technologies on Sept. 1 for "Method for fabricating film bulk acoustic resonator (FBAR), FBAR, and filter" (Singaporean, Chinese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,726,167, issued on Sept. 1, was assigned to AAC Technologies Pte. Ltd. (Tampines, Singapore). "Method for fabricating film bulk acoustic resona... Read More


US Patent Issued to Skyworks Solutions on Sept. 1 for "Acoustic wave device with multi-layer piezoelectric substrate" (American, Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,726,168, issued on Sept. 1, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Acoustic wave device with multi-layer piezoelectric subs... Read More


US Patent Issued to MURATA MANUFACTURING on Sept. 1 for "Acoustic wave device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,726,169, issued on Sept. 1, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Acoustic wave device" was invented by Sho Nagatomo (... Read More


US Patent Issued to MURATA MANUFACTURING on Sept. 1 for "Acoustic wave device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,726,170, issued on Sept. 1, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Acoustic wave device" was invented by Katsuya Daimon... Read More