ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,675, issued on Jan. 20, was assigned to Lam Research Corp. (Fremont, Calif.). "Core removal" was invented by Sivananda Krishnan Kanakasabap... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,472, issued on Jan. 20, was assigned to Solaredge Technologies Ltd. (Herzeliya, Israel). "Multilevel converter circuit and method" was inve... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,257, issued on Jan. 20, was assigned to NTT DOCOMO Inc. (Tokyo). "Terminal and communication method" was invented by Kouhei Harada (Tokyo),... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,527,772, issued on Jan. 20, was assigned to Vanda Pharmaceuticals Inc. (Washington). "Pharmaceutical combination comprising ponesimod" was inve... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,898, issued on Jan. 20, was assigned to Won International Inc. (Gwangiu, South Korea). "Artificial intelligence assistant device and system... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,850, issued on Jan. 20, was assigned to Cue Biopharma Inc. (Boston). "TGF-Beta polypeptides" was invented by Ronald D. Seidel III (Natick, ... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,297, issued on Jan. 20, was assigned to SK On Co. Ltd. (Seoul, South Korea). "Battery assembly and method of assembling the same" was inven... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,141, issued on Jan. 20, was assigned to Amazon Technologies Inc. (Seattle). "Set-based active speaker detection" was invented by Ritwik Gir... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,527,410, issued on Jan. 20, was assigned to NEW-TEC INTEGRATION (XIAMEN) Co. LTD. (Xiamen, China). "Spring module and spring cushion for furnit... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,769, issued on Jan. 20, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China). "Package substrate based on molding process... Read More