ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,527,598, issued on Jan. 20, was assigned to PHARAOH NEURO INC. (Minneapolis). "Medical device for accessing the central nervous system" was inv... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,367, issued on Jan. 20, was assigned to Apple Inc. (Cupertino, Calif.). "Adaptive radio operational modes" was invented by Thorsten Clevorn... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,739, issued on Jan. 20. "Techniques for phishing-resistant enrollment and on-device authentication" was invented by Stephen Woodward Lind (... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,971, issued on Jan. 20, was assigned to Eastman Chemical Co. (Kingsport, Tenn.). "Coating composition containing TMCD polyester and a modif... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,905, issued on Jan. 20, was assigned to HON HAI PRECISION INDUSTRY Co. LTD. (New Taipei, Taiwan). "Method for managing driving and electron... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,315, issued on Jan. 20, was assigned to QUALCOMM Inc. (San Diego). "Managing overlap between uplink control channel repetitions and uplink ... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,405, issued on Jan. 20, was assigned to Palo Alto Networks Inc. (Santa Clara, Calif.). "Explorable visual analytics system having reduced l... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,382, issued on Jan. 20, was assigned to IRISO ELECTRONICS Co. LTD. (Yokohama, Japan). "Connector" was invented by Takashi Sekine (Yokohama,... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,527,851, issued on Jan. 20, was assigned to Mayo Foundation for Medical Education and Research (Rochester, Minn.). "Methods and materials for t... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,711, issued on Jan. 20, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Manufacturing method of semiconductor package" was invente... Read More