ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,536,108, issued on Jan. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Storage device, operation method of the stor... और पढ़ें
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,244, issued on Jan. 27, was assigned to Globus Medical Inc. (Audubon, Pa.). "Expandable fusion device and method of installation thereof" w... और पढ़ें
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,115, issued on Jan. 27, was assigned to BOSTON SCIENTIFIC MEDICAL DEVICE Ltd. (Galway, Ireland). "Medical delivery devices, assemblies, and... और पढ़ें
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,234, issued on Jan. 27, was assigned to Robert Bosch GmbH (Stuttgart, Germany). "Energy store for an electrically drivable means of transpo... और पढ़ें
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,931, issued on Jan. 27, was assigned to WHISKEY LIMA Corp. (Pompano Beach, Fla.). "System and method for monitoring and purging atmosphere ... और पढ़ें
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,004, issued on Jan. 27, was assigned to CANON K.K. (Tokyo). "Imaging device" was invented by Yusuke Hirano (Kanagawa, Japan). According to... और पढ़ें
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,125, issued on Jan. 27, was assigned to HITACHI ASTEMO LTD. (Ibaraki, Japan). "Solenoid, damping force adjustment mechanism, and damping fo... और पढ़ें
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,536,128, issued on Jan. 27, was assigned to Mohan Kumar Jindal (Bangalore, India). "Device, system, and method for hardware small computer syst... और पढ़ें
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,363, issued on Jan. 27, was assigned to Alliance for Energy Innovation LLC (Golden, Colo.). "Fuel additives for storage and rapid generatio... और पढ़ें
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,598, issued on Jan. 27, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan). "Chip package structure and method for fabr... और पढ़ें