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US Patent Issued to KOREA ELECTRONICS TECHNOLOGY INSTITUTE on Nov. 3 for "Power conversion system with a plurality of heat emitters on different surfaces of a heatsink and includes a heat dissipation fan" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,213, issued on Nov. 3, was assigned to KOREA ELECTRONICS TECHNOLOGY INSTITUTE (Seongnam-si, South Korea). "Power conversion system with a pl... Read More


US Patent Issued to AUTEL ROBOTICS on Nov. 3 for "Heat dissipation structure and unmanned aerial vehicle" (Chinese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,214, issued on Nov. 3, was assigned to AUTEL ROBOTICS Co. LTD. (Shenzhen, China). "Heat dissipation structure and unmanned aerial vehicle" w... Read More


US Patent Issued to Hangzhou Dare Rouhan Technology on Nov. 3 for "Containerized single-phase liquid immersion cooling system" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,215, issued on Nov. 3, was assigned to Hangzhou Dare Rouhan Technology Co. Ltd. (Hangzhou, China). "Containerized single-phase liquid immers... Read More


US Patent Issued to Robert Bosch on Nov. 3 for "Cooler for cooling power electronics" (German Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,216, issued on Nov. 3, was assigned to Robert Bosch GmbH (Stuttgart, Germany). "Cooler for cooling power electronics" was invented by Maik P... Read More


US Patent Issued to DENSO on Nov. 3 for "Electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,217, issued on Nov. 3, was assigned to DENSO Corp. (Kariya-city, Japan). "Electronic device" was invented by Takuya Yamaguchi (Kariya-city, ... Read More


US Patent Issued to DELL PRODUCTS on Nov. 3 for "System and method for all-in-one liquid cooling module with integrated screw pumps" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,218, issued on Nov. 3, was assigned to DELL PRODUCTS LP (Round Rock, Texas). "System and method for all-in-one liquid cooling module with in... Read More


US Patent Issued to MITSUBISHI HEAVY INDUSTRIES on Nov. 3 for "Monitoring device" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,219, issued on Nov. 3, was assigned to MITSUBISHI HEAVY INDUSTRIES LTD. (Tokyo). "Monitoring device" was invented by Nobuhide Hara (Tokyo). ... Read More


US Patent Issued to APALTEK on Nov. 3 for "Water-cooling head structure capable of guiding leakage current and water-cooling device thereof" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,220, issued on Nov. 3, was assigned to APALTEK Co. LTD. (Shenzhen, China). "Water-cooling head structure capable of guiding leakage current ... Read More


US Patent Issued to Wiwynn on Nov. 3 for "Immersion cooling system and related immersion cooling method" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,221, issued on Nov. 3, was assigned to Wiwynn Corp. (New Taipei City, Taiwan). "Immersion cooling system and related immersion cooling metho... Read More


US Patent Issued to Flowserve on Nov. 3 for "Intelligent liquid cooling of electronic devices by actively controlled manifolds" (American, Singaporean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,222, issued on Nov. 3, was assigned to Flowserve Pte. Ltd. (Singapore). "Intelligent liquid cooling of electronic devices by actively contro... Read More