ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,582, issued on Dec. 16, was assigned to Elite Semiconductor Microelectronics Technology Inc. (Hsinchu, Taiwan). "Oscillator that performs l... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,498,443, issued on Dec. 16, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Positioning information determining method and co... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,560, issued on Dec. 16, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Organic light-emitting device and apparatus inc... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. D1,106,314, issued on Dec. 16, was assigned to Vicon Industries Inc. (Hauppauge, N.Y.). "Shroud for a modular sensor system" was invented by Hlynu... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,499,608, issued on Dec. 16, was assigned to GE PRECISION HEALTHCARE LLC (Waukesha, Wis.). "Methods and systems for multiplanar reformation with... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,499,670, issued on Dec. 16, was assigned to AMPERE S.A.S. (Boulogne-Billancourt, France). "Device and method for decision support of an artific... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,495,986, issued on Dec. 16, was assigned to JOHANN WOLFGANG GOETHE UNIVERSITAT FRANKFURT AM MAIN (Frankfurt am Main, Germany). "Quantitative im... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,496,418, issued on Dec. 16, was assigned to Loewenstein Medical Technology S.A. (Luxembourg). "Mask bead for a patient interface" was invented ... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,591, issued on Dec. 16, was assigned to HANGZHOU GEO-CHIP TECHNOLOGY Co. LTD. (Hangzhou, China). "Fast-locking phase-locked loop, frequency... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,155, issued on Dec. 16, was assigned to Intel Corp. (Santa Clara, Calif.). "Electronic package with passive component between substrates" w... Read More