Japan, Jan. 28 -- TOYOTA MOTOR CORP has got intellectual property rights for 'MANAGEMENT SYSTEM, METHOD FOR MANAGEMENT, AND MANAGEMENT PROGRAM.' Other related details are as follows: Application Numb... Read More
Japan, Jan. 28 -- MINEBEAMITSUMI INC has got intellectual property rights for 'ELECTRONIC LOCK MOUNTING STRUCTURE.' Other related details are as follows: Application Number: JP,2021-020335 Category ... Read More
Japan, Jan. 28 -- TOYOTA MOTOR CORP has got intellectual property rights for 'NEAR INFRARED REFLECTIVE COPPER OXIDE COATED PARTICLE.' Other related details are as follows: Application Number: JP,2022... Read More
Japan, Jan. 28 -- ASAHI KASEI HOMES CO has got intellectual property rights for 'DISASTER RESPONSE SUPPORT DEVICE, DISASTER RESPONSE SUPPORT PROGRAM, AND DISASTER RESPONSE SUPPORT METHOD.' Other relat... Read More
Japan, Jan. 28 -- KIRIN HOLDINGS CO LTD has got intellectual property rights for 'METHOD FOR DETERMINING STRUCTURE OF SUBSTANCE IN MULTICOMPONENT SAMPLE.' Other related details are as follows: Applic... Read More
Japan, Jan. 28 -- FUJISHOJI CO LTD has got intellectual property rights for 'GAME MACHINE.' Other related details are as follows: Application Number: JP,2024-199387 Category (FI): A63F7/02,304@D,A63... Read More
Japan, Jan. 28 -- PANASONIC INTELLECTUAL PROPERTY CORP OF AMERICA has got intellectual property rights for 'COMMUNICATION DEVICE, SCHEDULING NODE, COMMUNICATION METHOD, AND INTEGRATED CIRCUIT.' Other ... Read More
Japan, Jan. 28 -- TAISEI CORP,F T P CO LTD has got intellectual property rights for 'FOUNDATION STRUCTURE AND CONSTRUCTION METHOD OF THE SAME.' Other related details are as follows: Application Numbe... Read More
Japan, Jan. 28 -- SK ENPULSE CO LTD has got intellectual property rights for 'POLISHING PAD WITH REDUCED DEFECT GENERATION AND METHOD OF PREPARING SEMICONDUCTOR DEVICE USING THE SAME.' Other related d... Read More
Japan, Jan. 28 -- CHIPBOND TECHNOLOGY CORP has got intellectual property rights for 'CHIP.' Other related details are as follows: Application Number: JP,2024-102101 Category (FI): H01L21/60,311@Q,H0... Read More