Japan, Sept. 9 -- TADANO LTD has got intellectual property rights for 'CRANE.' Other related details are as follows: Application Number: JP,2022-200132 Category (FI): B66C13/12@D,B66C13/52@Z Stage:... Read More
Japan, Sept. 9 -- KOBASHI KOGYO CO LTD has got intellectual property rights for 'WORK MACHINE.' Other related details are as follows: Application Number: JP,2022-199665 Category (FI): A01B39/18@C,A0... Read More
Japan, Sept. 9 -- KAO CORP has got intellectual property rights for 'POLISHING LIQUID COMPOSITION.' Other related details are as follows: Application Number: JP,2022-199614 Category (FI): G11B5/84@A... Read More
Japan, Sept. 9 -- ADVICS CO LTD has got intellectual property rights for 'BRAKE DEVICE.' Other related details are as follows: Application Number: JP,2022-197101 Category (FI): B60T11/16@C,B60T8/17@... Read More
Japan, Sept. 9 -- TOYOTA MOTOR CORP,DENSO CORP has got intellectual property rights for 'OPERATION SUPPORT DEVICE.' Other related details are as follows: Application Number: JP,2022-196970 Category ... Read More
Japan, Sept. 9 -- FUJI ELECTRIC CO LTD has got intellectual property rights for 'SILICON CARBIDE SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2022-196318 Categ... Read More
Japan, Sept. 9 -- NGK INSULATORS LTD has got intellectual property rights for 'GAS SENSOR AND CONTROL METHOD OF GAS SENSOR.' Other related details are as follows: Application Number: JP,2022-196151 ... Read More
Japan, Sept. 9 -- TOYOTA CENTRAL R&D LABS INC,TOYOTA MOTOR CORP has got intellectual property rights for 'EVALUATION SENSOR, EVALUATION DEVICE AND EVALUATION METHOD.' Other related details are as foll... Read More
Japan, Sept. 9 -- SUMITOMO RUBBER IND LTD has got intellectual property rights for 'PNEUMATIC TIRE.' Other related details are as follows: Application Number: JP,2022-195781 Category (FI): B60C13/00... Read More
Japan, Sept. 9 -- SII PRINTEK INC has got intellectual property rights for 'HEAD CHIP, LIQUID JET HEAD, LIQUID JET RECORDING DEVICE AND MANUFACTURING METHOD FOR HEAD CHIP.' Other related details are a... Read More