Japan, June 10 -- SAMSUNG SDI CO LTD has got intellectual property rights for 'POSITIVE ELECTRODE ACTIVE MATERIAL, PREPARATION METHOD THEREOF, POSITIVE ELECTRODE INCLUDING THE SAME, AND LITHIUM SECOND... Read More
Japan, June 10 -- TAIHEI DENGYO KAISHA LTD has got intellectual property rights for 'MOISTURE REMOVAL DEVICE AND MOISTURE REMOVAL METHOD.' Other related details are as follows: Application Number: JP... Read More
Japan, June 10 -- NIPPON ZEON CO LTD has got intellectual property rights for 'HEAT CONDUCTIVE SHEET.' Other related details are as follows: Application Number: JP,2025-054228 Category (FI): H01L23/... Read More
Japan, June 10 -- WORKHORSE GROUP INC has got intellectual property rights for 'METHOD OF MAKING MONOCOQUE OF LAND VEHICLE USING MODULAR MOLD SYSTEM.' Other related details are as follows: Applicatio... Read More
Japan, June 10 -- RAPIDUS CORP has got intellectual property rights for 'ELECTRONIC DEVICE.' Other related details are as follows: Application Number: JP,2023-203323 Category (FI): H10W90/00,400@D,H... Read More
Japan, June 10 -- RAPIDUS CORP has got intellectual property rights for 'ELECTRONIC DEVICE.' Other related details are as follows: Application Number: JP,2023-203322 Category (FI): H05K1/181@D,H10W9... Read More
Japan, June 10 -- MAXELL LTD has got intellectual property rights for 'COORDINATION SYSTEM.' Other related details are as follows: Application Number: JP,2025-033597 Category (FI): H04M11/00,302,B26... Read More
Japan, June 10 -- DAIFUKU CO LTD has got intellectual property rights for 'GOODS CONVEYING FACILITY.' Other related details are as follows: Application Number: JP,2023-201484 Category (FI): G05D107:... Read More
Japan, June 10 -- YAZAKI CORP has got intellectual property rights for 'CONNECTOR.' Other related details are as follows: Application Number: JP,2023-201220 Category (FI): H01R13/42@F Stage: Grant ... Read More
Japan, June 10 -- UBE MACHINERY CORP LTD has got intellectual property rights for 'SUPPORT SYSTEM AND METHOD FOR REMOVING END CAP.' Other related details are as follows: Application Number: JP,2023-2... Read More