Japan, Aug. 6 -- RENESAS ELECTRONICS CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2023-034414 Category (FI): H01... Read More
Japan, Aug. 6 -- MIRISE TECHNOLOGIES CORP,DENSO CORP,TOYOTA MOTOR CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,20... Read More
Japan, Aug. 6 -- TOSHIBA LIGHTING & TECHNOLOGY CORP has got intellectual property rights for 'BATTERY DEVICE.' Other related details are as follows: Application Number: JP,2023-033565 Category (FI):... Read More
Japan, Aug. 6 -- SANKYO CO LTD has got intellectual property rights for 'SLOT MACHINE.' Other related details are as follows: Application Number: JP,2023-033352 Category (FI): A63F5/04,620 Stage: G... Read More
Japan, Aug. 6 -- SANKYO CO LTD has got intellectual property rights for 'SLOT MACHINE.' Other related details are as follows: Application Number: JP,2023-033351 Category (FI): A63F5/04,620,A63F5/04,... Read More
Japan, Aug. 6 -- SANKYO CO LTD has got intellectual property rights for 'SLOT MACHINE.' Other related details are as follows: Application Number: JP,2023-033350 Category (FI): A63F5/04,620 Stage: G... Read More
Japan, Aug. 6 -- SANKYO CO LTD has got intellectual property rights for 'SLOT MACHINE.' Other related details are as follows: Application Number: JP,2023-033349 Category (FI): A63F5/04,620 Stage: G... Read More
Japan, Aug. 6 -- YOKOGAWA ELECTRIC CORP has got intellectual property rights for 'ANALYSIS DEVICE, ANALYSIS METHOD, ANALYSIS PROGRAM AND WATER TREATMENT SYSTEM.' Other related details are as follows: ... Read More
Japan, Aug. 6 -- BEKKU KK has got intellectual property rights for 'FORMATION OF DECORATIVE COATING SURFACE.' Other related details are as follows: Application Number: JP,2024-104823 Category (FI): ... Read More
Japan, Aug. 6 -- DENSO CORP,TOYOTA MOTOR CORP has got intellectual property rights for 'BATTERY PACK.' Other related details are as follows: Application Number: JP,2023-030922 Category (FI): H01M50/... Read More