Japan, March 25 -- SEIKO CORP has got intellectual property rights for 'METERING DEVICE.' Other related details are as follows: Application Number: JP,2022-025471 Category (FI): B67C3/00@A,B67C3/02@... Read More
Japan, March 25 -- SEIKO EPSON CORP has got intellectual property rights for 'RECORDING DEVICE, RECORDING SYSTEM, AND RECORDING METHOD.' Other related details are as follows: Application Number: JP,2... Read More
Japan, March 25 -- RICOH CO LTD has got intellectual property rights for 'INFORMATION PROCESSING SYSTEM, COMMUNICATION SYSTEM, IMAGE TRANSMITTING METHOD, AND PROGRAM.' Other related details are as fol... Read More
Japan, March 25 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'DEVICE CHIP MANUFACTURING METHOD.' Other related details are as follows: Application Number: JP,2022-025048 Categ... Read More
Japan, March 25 -- PANASONIC IP MANAGEMENT CORP has got intellectual property rights for 'WIRELESS COMMUNICATION METHOD AND WIRELESS COMMUNICATION SYSTEM.' Other related details are as follows: Appli... Read More
Japan, March 25 -- SAKATA CORP has got intellectual property rights for 'WHITE PIGMENT DISPERSION, AQUEOUS INKJET INK COMPOSITION, AND PRINTED MATTER.' Other related details are as follows: Applicati... Read More
Japan, March 25 -- IWAZU HARUO has got intellectual property rights for 'ELECTROLYTIC TREATMENT METHOD AND ELECTROLYTIC TREATMENT APPARATUS.' Other related details are as follows: Application Number:... Read More
Japan, March 25 -- HYOGO PREFECTURE SOCIAL WELFARE CORP,KINKI UNIV,NIHON MEDI PHYSICS CO LTD has got intellectual property rights for 'IMAGE PROCESSING PROGRAM, IMAGE PROCESSING METHOD, AND IMAGE PROC... Read More
Japan, March 25 -- LINTEC CORP has got intellectual property rights for 'ADHESIVE SHEET.' Other related details are as follows: Application Number: JP,2022-023719 Category (FI): B32B27/00@M,B32B27/3... Read More
Japan, March 25 -- NIDEC INSTRUMENTS CORP has got intellectual property rights for 'NON-CONTACT INFORMATION PROCESSING DEVICE.' Other related details are as follows: Application Number: JP,2022-02369... Read More