Japan, March 25 -- HAZAMA KISETSU KOGYO KK,SANKI ENG CO LTD has got intellectual property rights for 'ALGAE REMOVING DEVICE IN CIRCULAR SEDIMENTATION BASIN.' Other related details are as follows: App... Read More
Japan, March 25 -- YAMAHA CORP has got intellectual property rights for 'INPUT DEVICE, CONTROL METHOD THEREFOR, AND PROGRAM.' Other related details are as follows: Application Number: JP,2022-049447 ... Read More
Japan, March 25 -- MITSUBISHI MATERIALS CORP,MITSUBISHI CABLE IND LTD has got intellectual property rights for 'THERMOPLASTIC ELASTOMER COMPOSITION, HEAT CONDUCTIVE SHEET, AND HEAT DISSIPATION STRUCTU... Read More
Japan, March 25 -- KAO CORP has got intellectual property rights for 'POLISHING LIQUID COMPOSITION FOR SILICON OXIDE FILMS.' Other related details are as follows: Application Number: JP,2022-048762 ... Read More
Japan, March 25 -- TOSHIBA CORP,TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTION CORP has got intellectual property rights for 'MICROPARTICLE MEASURING SYSTEM AND MICROPARTICLE MEASURING METHOD.' Other relat... Read More
Japan, March 25 -- KOMATSU LTD has got intellectual property rights for 'WORK MACHINE.' Other related details are as follows: Application Number: JP,2022-048663 Category (FI): E02F3/36@A,E02F3/36@C,... Read More
Japan, March 25 -- FUJIFILM BUSINESS INNOVATION CORP has got intellectual property rights for 'DEVELOPING DEVICE AND IMAGE FORMING APPARATUS.' Other related details are as follows: Application Number... Read More
Japan, March 25 -- HONDA MOTOR CO LTD has got intellectual property rights for 'ALL-SOLID BATTERY AND BATTERY MODULE.' Other related details are as follows: Application Number: JP,2022-048399 Catego... Read More
Japan, March 25 -- SUMITOMO RUBBER IND LTD has got intellectual property rights for 'METHOD FOR PREDICTING WEAR RESISTANCE PERFORMANCE.' Other related details are as follows: Application Number: JP,2... Read More
Japan, March 25 -- KIOXIA CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE.' Other related details are as follows: Application Number: JP,2022-04756... Read More