Japan, Oct. 30 -- DAINIPPON PRINTING CO LTD has got intellectual property rights for 'DECORATIVE SHEET.' Other related details are as follows: Application Number: JP,2021-125221 Category (FI): B60R1... Read More
Japan, Oct. 30 -- KASHIWA TAKAFUMI has got intellectual property rights for 'INFORMATION PROVIDING DEVICE, INFORMATION PROVIDING PROGRAM, AND INFORMATION PROVIDING SYSTEM.' Other related details are a... Read More
Japan, Oct. 30 -- FUJI ELECTRIC CO LTD has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE.' Other related details are as follows: Applica... Read More
Japan, Oct. 30 -- KANSAI UNIV,TOSOH FINECHEM CORP has got intellectual property rights for 'POROUS ZINC COMPLEX AND ITS MANUFACTURING METHOD.' Other related details are as follows: Application Number... Read More
Japan, Oct. 30 -- EBARA SHOKUHIN KOGYO KK has got intellectual property rights for 'LIQUID SEASONING.' Other related details are as follows: Application Number: JP,2020-122655 Category (FI): A23L27/... Read More
Japan, Oct. 30 -- CANON INC has got intellectual property rights for 'PHOTODETECTION ELEMENT AND PHOTOELECTRIC CONVERSION DEVICE.' Other related details are as follows: Application Number: JP,2020-12... Read More
Japan, Oct. 30 -- UNIVERSAL DISPLAY CORP has got intellectual property rights for 'HEIGHT MEASUREMENT AND CONTROL IN CONFINED SPACE FOR VAPOR DEPOSITION SYSTEM.' Other related details are as follows: ... Read More
Japan, Oct. 30 -- SK HYNIX INC has got intellectual property rights for 'EDGE-BASED SHARPNESS STRENGTH CONTROL CIRCUIT, IMAGE SENSING DEVICE, AND OPERATION METHOD THEREOF.' Other related details are a... Read More
Japan, Oct. 30 -- TOAGOSEI CO LTD has got intellectual property rights for 'BINDER FOR PRODUCING CERAMIC GREEN SHEET, SLURRY COMPOSITION, CERAMIC GREEN SHEET, AND METHOD FOR PRODUCING MULTILAYER CERAM... Read More
Japan, Oct. 30 -- HAMILTON SUNDSTRAND CORP has got intellectual property rights for 'TOROIDAL TRANSFORMER ASSEMBLY AND ELECTRONIC COMPONENT MODULE ASSEMBLY.' Other related details are as follows: App... Read More