GENEVA, July 2 -- LIVEVIEW TECHNOLOGIES, LLC filed a patent application (US2025/041353) for “ACCESS CONTROL, AND ASSOCIATED SYSTEMS, DEVICES, MOBILE UNITS, AND METHODS”. With publication no. WO/2026/1... Read More
GENEVA, July 2 -- SONY INTERACTIVE ENTERTAINMENT INC. filed a patent application (US2025/041962) for “SYSTEMS AND METHODS FOR MANAGING SHORT RANGE WIRELESS CONNECTION SESSIONS AND DEVICE CONTROL”. Wit... Read More
GENEVA, July 2 -- FLORIDA STATE UNIVERSITY RESEARCH FOUNDATION, INC. filed a patent application (US2025/043668) for “COMPOSITIONS AND METHODS FOR INHIBITING TYPE I COLLAGEN PRODUCTION”. With publicati... Read More
GENEVA, July 2 -- DEFENSE DIAGNOSTICS INC. filed a patent application (US2025/034165) for “ANALYTE DETECTION APPARATUS”. With publication no. WO/2026/135732, here are the other details related to the ... Read More
GENEVA, July 2 -- CURIE CO. INC. filed a patent application (US2025/035469) for “ANTIMICROBIAL COMPOSITIONS”. With publication no. WO/2026/135733, here are the other details related to the patent appl... Read More
GENEVA, July 2 -- GENZYME CORPORATION filed a patent application (US2025/036202) for “HOLD ASSISTANCE DEVICE FOR USE WITH A MEDICAMENT DELIVERY DEVICE”. With publication no. WO/2026/135734, here are t... Read More
GENEVA, July 2 -- MICROCHIP TECHNOLOGY INCORPORATED filed a patent application (US2025/032191) for “SEMICONDUCTOR PACKAGING USING A LOW DIELECTRIC CONSTANT POLYMER IN TARGETED AREAS IN CONJUNCTION WIT... Read More
GENEVA, July 2 -- MICROCHIP TECHNOLOGY INCORPORATED filed a patent application (US2025/032633) for “SEMICONDUCTOR DEVICE WITH CARRIER HEAT SINK”. With publication no. WO/2026/135730, here are the othe... Read More
GENEVA, July 2 -- MICROCHIP TECHNOLOGY INCORPORATED filed a patent application (US2025/032815) for “SEMICONDUCTOR DEVICE WITH PATTERNED WAVE GUIDE AND SELF-ALIGNED COMPONENT PLACEMENT”. With publicati... Read More
GENEVA, July 2 -- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC filed a patent application (US2025/025615) for “LEVELING CONTROL FOR SEMICONDUCTOR DEVICE PACKAGE ATTACHMENT”. With publication no. WO/2026/1... Read More