Exclusive

Publication

Byline

Location

Meshdynamics (Beijing) Information Technology Co.,Ltd secures contract for Procurement of 0834-2641SH26A084 01 Laser cooling equipment 2

China, April 22 -- China based Meshdynamics (Beijing) Information Technology Co.,Ltd has secured contract from Shanghai Institute of Optics and Fine Mechanics Chinese Academy of Sciences for Procureme... Read More


Hangzhou Parts Electronics co.,Ltd secures contract for Procurement of 0677-2640J0312127 03 Semiconductor Chip Equipment Procurement Project 1

China, April 22 -- China based Hangzhou Parts Electronics co.,Ltd has secured contract from JINAN JINGHENG ELECTRONICS CO.,LTD. for Procurement of 0677-2640J0312127 03 Semiconductor Chip Equipment Pro... Read More


Hangzhou Parts Electronics co.,Ltd secures contract for Procurement of 0677-2640J0312127 02 Semiconductor Chip Equipment Procurement Project 1

China, April 22 -- China based Hangzhou Parts Electronics co.,Ltd has secured contract from JINAN JINGHENG ELECTRONICS CO.,LTD. for Procurement of 0677-2640J0312127 02 Semiconductor Chip Equipment Pro... Read More


VISION WIDE TECH CO., LTD. secures contract for Procurement of 0842-264GJ2600009 04 Machining Equipment 2

China, April 22 -- China based VISION WIDE TECH CO., LTD. has secured contract from Himile Mechanical Science and Technology (Rizhao) Co.,Ltd. for Procurement of 0842-264GJ2600009 04 Machining Equipme... Read More


Wuxi Hongchen Jiaye Technology Co., Ltd. secures contract for Procurement of 0677-2640J0312127 04 Semiconductor Chip Equipment Procurement Project 1

China, April 22 -- China based Wuxi Hongchen Jiaye Technology Co., Ltd. has secured contract from JINAN JINGHENG ELECTRONICS CO.,LTD. for Procurement of 0677-2640J0312127 04 Semiconductor Chip Equipme... Read More


Hangzhou Parts Electronics co.,Ltd secures contract for Procurement of 0677-2640J0312127 01 Semiconductor Chip Equipment Procurement Project 1

China, April 22 -- China based Hangzhou Parts Electronics co.,Ltd has secured contract from JINAN JINGHENG ELECTRONICS CO.,LTD. for Procurement of 0677-2640J0312127 01 Semiconductor Chip Equipment Pro... Read More


Hangzhou Parts Electronics co.,Ltd secures contract for Procurement of 0677-2640J0312127 05 Semiconductor Chip Equipment Procurement Project 1

China, April 22 -- China based Hangzhou Parts Electronics co.,Ltd has secured contract from JINAN JINGHENG ELECTRONICS CO.,LTD. for Procurement of 0677-2640J0312127 05 Semiconductor Chip Equipment Pro... Read More


SuZhou YongYa Semiconductor CO.LTD secures contract for Procurement of 0677-2640J0312127 06 Semiconductor Chip Equipment Procurement Project 1

China, April 22 -- China based SuZhou YongYa Semiconductor CO.LTD has secured contract from JINAN JINGHENG ELECTRONICS CO.,LTD. for Procurement of 0677-2640J0312127 06 Semiconductor Chip Equipment Pro... Read More


Advanced Materials Technology &Engineering.Co. Ltd. secures contract for Procurement of 0677-2640J0312127 07 Semiconductor Chip Equipment Procurement Project 1

China, April 22 -- China based Advanced Materials Technology &Engineering.Co. Ltd. has secured contract from JINAN JINGHENG ELECTRONICS CO.,LTD. for Procurement of 0677-2640J0312127 07 Semiconduct... Read More


TYRON secures contract for Procurement of 0677-2640J0312127 08 Semiconductor Chip Equipment Procurement Project 1

China, April 22 -- China based TYRON has secured contract from JINAN JINGHENG ELECTRONICS CO.,LTD. for Procurement of 0677-2640J0312127 08 Semiconductor Chip Equipment Procurement Project 1. The value... Read More