ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,739, issued on July 14, was assigned to Mellanox Technologies Ltd. (Yokneam, Israel). "System and method for radiative cooling for data cen... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,740, issued on July 14, was assigned to WIWYNN Corp. (New Taipei City, Taiwan). "Electronic device and control method of fan speed thereof"... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,741, issued on July 14, was assigned to PRIMAX ELECTRONICS LTD. (Taipei City, Taiwan). "Vehicle device" was invented by Chih-Wei Hu (Taipei... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,742, issued on July 14, was assigned to Siemens AG (Munich). "Apparatus for enclosing a power unit and for centring a control unit with res... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,743, issued on July 14, was assigned to Lunar Energy Inc. (Mountain View, Calif.). "Thermal management system including an overmolded layer... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,744, issued on July 14, was assigned to Cummins Inc. (Columbus, Ind.). "Power converters which are scalable and/or provide a high degree of... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,745, issued on July 14, was assigned to Fronius International GmbH (Pettenbach, Austria). "Cooling device having a fan and housing having a... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,747, issued on July 14, was assigned to Manufacturing Resources International Inc. (Alpharetta, Ga.). "Method for thermally managing a comm... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,748, issued on July 14, was assigned to HDT Expeditionary Systems Inc. (Solon, Ohio) and Berg Cos. Inc. (Spokane, Wash.). "Shelter with ele... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,749, issued on July 14, was assigned to Murata Manufacturing Co. Ltd. (Kyoto-fu, Japan). "Electronic component module" was invented by Akio... Read More