ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,736, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Shield to reduce substrate electromagnetic interference and w... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,736, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Shield to reduce substrate electromagnetic interference and w... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,737, issued on April 14, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Electronic assembly comprising metal foil layer ... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,737, issued on April 14, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Electronic assembly comprising metal foil layer ... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,738, issued on April 14, was assigned to The Charles Stark Draper Laboratory Inc. (Cambridge, Mass.). "Systems and methods for providing d... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,738, issued on April 14, was assigned to The Charles Stark Draper Laboratory Inc. (Cambridge, Mass.). "Systems and methods for providing d... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,739, issued on April 14, was assigned to JCET STATS ChipPAC Korea Ltd. (South Korea). "Semiconductor device and method of forming a 3-D st... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,739, issued on April 14, was assigned to JCET STATS ChipPAC Korea Ltd. (South Korea). "Semiconductor device and method of forming a 3-D st... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,740, issued on April 14, was assigned to XILINX INC. (San Jose, Calif.). "Chip package with integrated embedded off-die inductors" was inv... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,740, issued on April 14, was assigned to XILINX INC. (San Jose, Calif.). "Chip package with integrated embedded off-die inductors" was inv... और पढ़ें