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US Patent Issued to Intel on April 14 for "Microelectronic assemblies including stiffeners around individual dies" (German, American Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,759, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic assemblies including stiffeners around indivi... और पढ़ें


US Patent Issued to FUJI ELECTRIC on April 14 for "Semiconductor module and method for manufacturing semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,760, issued on April 14, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module and method for manufacturing semi... और पढ़ें


US Patent Issued to FUJI ELECTRIC on April 14 for "Semiconductor module and method for manufacturing semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,760, issued on April 14, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module and method for manufacturing semi... और पढ़ें


US Patent Issued to Shanghai Tianma Micro-electronics on April 14 for "LED display panel and display device with groove in non-display region" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,761, issued on April 14, was assigned to Shanghai Tianma Micro-electronics Co. Ltd. (Shanghai). "LED display panel and display device with... और पढ़ें


US Patent Issued to Shanghai Tianma Micro-electronics on April 14 for "LED display panel and display device with groove in non-display region" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,761, issued on April 14, was assigned to Shanghai Tianma Micro-electronics Co. Ltd. (Shanghai). "LED display panel and display device with... और पढ़ें


US Patent Issued to Intel on April 14 for "Methods and apparatus to reduce thickness of on-package memory architectures" (Malaysian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,762, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods and apparatus to reduce thickness of on-package memor... और पढ़ें


US Patent Issued to Intel on April 14 for "Methods and apparatus to reduce thickness of on-package memory architectures" (Malaysian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,762, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods and apparatus to reduce thickness of on-package memor... और पढ़ें


US Patent Issued to OSRAM Opto Semiconductors on April 14 for "Method for producing a plurality of components, component, and component assembly" (German Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,763, issued on April 14, was assigned to OSRAM Opto Semiconductors GmbH (Regensburg, Germany). "Method for producing a plurality of compon... और पढ़ें


US Patent Issued to OSRAM Opto Semiconductors on April 14 for "Method for producing a plurality of components, component, and component assembly" (German Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,763, issued on April 14, was assigned to OSRAM Opto Semiconductors GmbH (Regensburg, Germany). "Method for producing a plurality of compon... और पढ़ें


US Patent Issued to Samsung Display on April 14 for "Display device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,764, issued on April 14, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device and method of fabricating the ... और पढ़ें