GENEVA, July 1 -- SUMITOMO ELECTRIC INDUSTRIES, LTD. filed a patent application (JP2025/043175) for “OPTICAL FIBER COATING REMOVER, OPTICAL FIBER COATING REMOVAL METHOD, AND OPTICAL FIBER CORE”. With ... Read More
GENEVA, July 1 -- FUJIFILM CORPORATION filed a patent application (JP2025/043125) for “REFRIGERANT COMPOSITION AND COOLING SYSTEM”. With publication no. WO/2026/127067, here are the other details rela... Read More
GENEVA, July 1 -- MITSUI CHEMICALS, INC. filed a patent application (JP2025/043133) for “COMPOSITION, TRIHYDROXYBENZENE HAVING A PROTECTIVE GROUP, AND PRODUCTION METHOD OF TRIHYDROXYBENZENE”. With pub... Read More
GENEVA, July 1 -- SEEDNA INC. filed a patent application (JP2025/043137) for “GENETIC ANALYSIS METHOD AND GENETIC DETERMINATION METHOD”. With publication no. WO/2026/127069, here are the other details... Read More
GENEVA, July 1 -- TOKYO OHKA KOGYO CO., LTD. filed a patent application (JP2025/043102) for “RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND ACID DIFFUSION CONTROLLING AGENT”. Wit... Read More
GENEVA, July 1 -- NATIONAL UNIVERSITY CORPORATION ASAHIKAWA MEDICAL UNIVERSITY filed a patent application (JP2025/043108) for “PHARMACEUTICAL COMPOSITION FOR TREATING CANCER”. With publication no. WO/... Read More
GENEVA, July 1 -- NIPPON STEEL CORPORATION filed a patent application (JP2025/043119) for “SURFACE-TREATED METAL SHEET AND AUTOMOTIVE MEMBER COMPRISING SAME”. With publication no. WO/2026/127066, here... Read More
GENEVA, July 1 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION filed a patent application (JP2025/043061) for “LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, AND IMAGE DISPLAY APPARATUS”. With publication... Read More
GENEVA, July 1 -- ENEOS CORPORATION filed a patent application (JP2025/043072) for “METHOD FOR PRODUCING GREASE COMPOSITION”. With publication no. WO/2026/127060, here are the other details related to... Read More
GENEVA, July 1 -- RESONAC CORPORATION filed a patent application (JP2025/043083) for “CURABLE RESIN MATERIAL, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE... Read More