US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Computing device and electronic device guaranteeing bandwidth per computational performance" (South Korean, American Inventors)

Posted On: 2026-08-18

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,888, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Computing device and electronic device guara... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Semiconductor structure with enhanced voltage stress control and method of forming the same" (Taiwanese Inventors)

Posted On: 2026-08-18

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ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,889, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure with en... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Computing device and electronic device guaranteeing bandwidth per computational performance" (South Korean, American Inventors)

Posted On: 2026-08-18

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,890, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Computing device and electronic device guara... Read More

US Patent Issued to Advanced Semiconductor Engineering on Aug. 18 for "Electronic device" (Taiwanese Inventors)

Posted On: 2026-08-18

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ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,891, issued on Aug. 18, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Electronic device" was invented by Ch... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Semiconductor device including interconnect structure with metal jump structure connecting adjacent metal lines" (New York, Virginia Inventors)

Posted On: 2026-08-18

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ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,892, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea). "Semiconductor device including interconnect structure ... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Conductive structure in semiconductor structure and method for forming the same" (Taiwanese Inventors)

Posted On: 2026-08-18

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ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,893, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Conductive structure in semicon... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Three-dimensional semiconductor memory device and electronic system including the same" (South Korean Inventor)

Posted On: 2026-08-18

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,894, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Three-dimensional semiconductor memory devic... Read More

US Patent Issued to Samsung Electronics on Aug. 18 for "Semiconductor package and method for manufacturing the same" (South Korean Inventors)

Posted On: 2026-08-18

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ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,895, issued on Aug. 18, was assigned to Samsung Electronics Co Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and method for manuf... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Interconnect structure and methods of forming the same" (Taiwanese Inventors)

Posted On: 2026-08-18

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,896, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Interconnect structure and meth... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Semiconductor structure having back-side contact and manufacturing method thereof" (Taiwanese Inventor)

Posted On: 2026-08-18

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,897, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure having ... Read More

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US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Computing device and electronic device guaranteeing bandwidth per computational performance" (South Korean, American Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Semiconductor structure with enhanced voltage stress control and method of forming the same" (Taiwanese Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Computing device and electronic device guaranteeing bandwidth per computational performance" (South Korean, American Inventors)

US Patent Issued to Advanced Semiconductor Engineering on Aug. 18 for "Electronic device" (Taiwanese Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Semiconductor device including interconnect structure with metal jump structure connecting adjacent metal lines" (New York, Virginia Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Conductive structure in semiconductor structure and method for forming the same" (Taiwanese Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Three-dimensional semiconductor memory device and electronic system including the same" (South Korean Inventor)

US Patent Issued to Samsung Electronics on Aug. 18 for "Semiconductor package and method for manufacturing the same" (South Korean Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Interconnect structure and methods of forming the same" (Taiwanese Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Semiconductor structure having back-side contact and manufacturing method thereof" (Taiwanese Inventor)