GENEVA, July 18 -- MASTERCARD INTERNATIONAL INCORPORATED filed a patent application (US2025/058754) for “PREVENTING NETWORK SECURTY THREATS”. With publication no. WO/2026/151551, here are the other de... Read More
GENEVA, July 18 -- QUALCOMM INCORPORATED filed a patent application (US2025/058840) for “INTERCELL COORDINATION FOR INTERFERENCE ESTIMATION AND NULLING”. With publication no. WO/2026/151552, here are ... Read More
GENEVA, July 18 -- CATERPILLAR INC. filed a patent application (US2025/058883) for “BATTERY SENSOR CALIBRATION”. With publication no. WO/2026/151553, here are the other details related to the patent a... Read More
GENEVA, July 18 -- QUALCOMM INCORPORATED filed a patent application (US2025/058887) for “FREQUENCY MODULATED CONTINUOUS WAVE SYNCHRONIZATION SIGNAL DESIGN FOR MULTIPLE CELLS”. With publication no. WO/... Read More
GENEVA, July 18 -- CATERPILLAR INC. filed a patent application (US2025/058522) for “BATTERY MANAGEMENT SYSTEM MISCONFIGURATION DETECTION”. With publication no. WO/2026/151547, here are the other detai... Read More
GENEVA, July 18 -- EXXONMOBIL TECHNOLOGY AND ENGINEERING COMPANY filed a patent application (US2025/058622) for “PITCH VIA FRIEDEL-CRAFTS REACTION OR INCORPORATION OF ORTHO-DIYNYLARENE”. With publicat... Read More
GENEVA, July 18 -- QUALCOMM INCORPORATED filed a patent application (US2025/058646) for “COORDINATED ACCESS POINT ASSISTANCE INDICATION AND POLLING”. With publication no. WO/2026/151549, here are the ... Read More
GENEVA, July 18 -- CARLSMED, INC. filed a patent application (US2025/057973) for “POSTERIOR FIXATION SYSTEMS FOR SPINAL TREATMENTS”. With publication no. WO/2026/151544, here are the other details rel... Read More
GENEVA, July 18 -- QUALCOMM INCORPORATED filed a patent application (US2025/057975) for “TECHNIQUES FOR DOWNLINK CONTROL INFORMATION (DCI) PIGGYBACKING IN MULTI-LAYER DOWNLINK MULTIPLE INPUT MULTIPLE ... Read More
GENEVA, July 18 -- WESTERN DIGITAL TECHNOLOGIES, INC. filed a patent application (US2025/058377) for “CONTINUOUS TRANSIENT COOLING FOR SEMICONDUCTOR CHIP”. With publication no. WO/2026/151546, here ar... Read More