Japan, July 31 -- TOKYO SEIMITSU CO LTD has got intellectual property rights for 'CHARGE/DISCHARGE TESTING SYSTEM, AND CONTROL METHOD OF CHARGE/DISCHARGE TESTING SYSTEM.' Other related details are as ... Read More
Japan, July 31 -- NITTO DENKO CORP has got intellectual property rights for 'OPTICAL SEMICONDUCTOR DEVICE SEALING SHEET AND DISPLAY.' Other related details are as follows: Application Number: JP,2022... Read More
Japan, July 31 -- IHI CORP,IHI TRANSPORT MACHINERY CO LTD has got intellectual property rights for 'LOCATION ESTIMATION SYSTEM AND LOCATION ESTIMATION METHOD.' Other related details are as follows: A... Read More
Japan, July 31 -- SHIMADZU CORP,TOKYO INSTITUTE OF TECHNOLOGY has got intellectual property rights for 'LUCIFERASE-ACTIVE PROTEIN.' Other related details are as follows: Application Number: JP,2022-1... Read More
Japan, July 31 -- HIGASHIYAMA FILM KK has got intellectual property rights for 'COVER FILM WITH PROTECTIVE FILM.' Other related details are as follows: Application Number: JP,2022-157749 Category (F... Read More
Japan, July 31 -- NOF CORP has got intellectual property rights for 'EMULSION COSMETIC.' Other related details are as follows: Application Number: JP,2022-156320 Category (FI): A61Q17/04,A61K8/06,A6... Read More
Japan, July 31 -- RENESAS ELECTRONICS CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2022-155106 Category (FI): G0... Read More
Japan, July 31 -- NIPPON STEEL CORP has got intellectual property rights for 'OPERATION METHOD FOR BATCH TYPE HEATING FURNACE.' Other related details are as follows: Application Number: JP,2022-15427... Read More
Japan, July 31 -- TOP CO LTD has got intellectual property rights for 'SYRINGE CONNECTOR.' Other related details are as follows: Application Number: JP,2022-154187 Category (FI): A61M39/10,110 Stag... Read More
Japan, July 31 -- DAIHEN CORP has got intellectual property rights for 'HIGH VOLTAGE ELECTRIC COMPONENT.' Other related details are as follows: Application Number: JP,2022-152174 Category (FI): H01F... Read More