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US Patent Issued to Samsung Display on May 19 for "Semiconductor light emitting diode including passivation layer having different thicknesses" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,309, issued on May 19, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Semiconductor light emitting diode including pass... Read More


US Patent Issued to LG Electronics on May 19 for "Semiconductor light-emitting device self-assembly apparatus to solve assembly defect generated during self-assembly" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,310, issued on May 19, was assigned to LG Electronics Inc. (Seoul, South Korea). "Semiconductor light-emitting device self-assembly apparatu... Read More


US Patent Issued to Innolux on May 19 for "Electronic device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,311, issued on May 19, was assigned to Innolux Corp. (Miaoli County, Taiwan). "Electronic device and manufacturing method thereof" was inven... Read More


US Patent Issued to CreeLED on May 19 for "Cover structure arrangements for light emitting diode packages" (North Carolina, Ohio Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,312, issued on May 19, was assigned to CreeLED Inc. (Durham, N.C.). "Cover structure arrangements for light emitting diode packages" was inv... Read More


US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Transfer method of aligning, placing, and bonding micro semiconductor chips on substrate" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,313, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Transfer method of aligning, placing, and bond... Read More


US Patent Issued to Nothing Technology on May 19 for "Light-emitting module emitting color light and method for manufacturing the same, display panel, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,314, issued on May 19, was assigned to Nothing Technology Ltd. (London). "Light-emitting module emitting color light and method for manufact... Read More


US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Nanostructures, production method thereof, electronic device including the same" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,315, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea). "Nanostructures, production method thereof, ... Read More


US Patent Issued to SANKEN ELECTRIC on May 19 for "Light emitting device" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,316, issued on May 19, was assigned to SANKEN ELECTRIC Co. LTD. (Niiza, Japan). "Light emitting device" was invented by Yousuke Umetsu (Niiz... Read More


US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Light emitting diode module and display apparatus having the same" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,317, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Light emitting diode module and display appara... Read More


US Patent Issued to TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY on May 19 for "Display panel including a spliced display screen" (Chinese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,318, issued on May 19, was assigned to TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY Co. LTD. (Shenzhen, China). "Display panel including a spli... Read More