ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,159, issued on July 21, was assigned to SONY INTERACTIVE ENTERTAINMENT INC. (Tokyo). "Electronic apparatus and control method therefor" was... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,160, issued on July 21, was assigned to LightSpeed Photonics Pte Ltd (Singapore). "Hexagonal heatsink system" was invented by Venkata Raman... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,161, issued on July 21, was assigned to ENERGY COOL GLOBAL APS (Fredericia, Denmark). "Temperature-controlled enclosure for containing temp... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,162, issued on July 21. "Single phase liquid immersion cooling system with forced cooling circuit" was invented by Fang-Shou Lee (Taoyuan, ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,163, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Automatic leveling immersion coolin... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,164, issued on July 21, was assigned to BULL SAS (Les Clayes sous Bois, France) and LE COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALT... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,165, issued on July 21, was assigned to AMD DESIGN LLC (Wilmington, Del.). "Manifold system for computing assembly" was invented by Robert ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,166, issued on July 21, was assigned to DENSO Corp. (Kariya-city, Japan). "Cooling device" was invented by Kimio Kohara (Kariya-city, Japan... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,167, issued on July 21, was assigned to ASIA VITAL COMPONENTS Co. LTD. (New Taipei City, Taiwan). "Support structure of heat dissipation un... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,168, issued on July 21, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory sub-system enclosure" was invented by Suresh Reddy Y... Read More