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INTERNATIONAL PATENT: OMRON CORPORATION, オムロン株式会社, INSTITUTE OF SCIENCE TOKYO, 国立大学法人東京科学大学 FILES APPLICATION FOR "INFERENCE DEVICE, INFERENCE PROGRAM, INFERENCE METHOD, GENERATION METHOD AND GENERATION DEVICE"

GENEVA, Jan. 27 -- OMRON CORPORATION (801, Minamifudodo-cho, Horikawahigashiiru, Shiokoji-dori, Shimogyo-ku, Kyoto-shi, Kyoto6008530), オムロン株式会社 ... Read More


INTERNATIONAL PATENT: FUJIFILM CORPORATION, 富士フイルム株式会社 FILES APPLICATION FOR "FAN WITH SILENCER AND SILENCER"

GENEVA, Jan. 27 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), 富士フイルム株式会社 (東京都... Read More


INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND PROGRAM"

GENEVA, Jan. 27 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1, Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソ&#... Read More


INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND INFORMATION PROCESSING SYSTEM"

GENEVA, Jan. 27 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1, Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソ&#... Read More


INTERNATIONAL PATENT: DENSO CORPORATION, 株式会社デンソー FILES APPLICATION FOR "VEHICLE CONTROL DEVICE"

GENEVA, Jan. 27 -- DENSO CORPORATION (1-1, Showa-cho, Kariya-city Aichi4488661), 株式会社デンソー (愛知県刈谷市&#261... Read More


INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "IMAGE PROCESSING DEVICE AND METHOD"

GENEVA, Jan. 27 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1, Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソ&#... Read More


INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, 東京エレクトロン株式会社 FILES APPLICATION FOR "PLASMA PROCESSING APPARATUS AND UPPER ELECTRODE ASSEMBLY"

GENEVA, Jan. 27 -- TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-ku, Tokyo1076325), 東京エレクトロン株式会社 (東&#20... Read More


INTERNATIONAL PATENT: KYOCERA CORPORATION, 京セラ株式会社 FILES APPLICATION FOR "PACKAGING FOR CHIP-SHAPED ELECTRONIC COMPONENTS AND CHIP-SHAPED ELECTRONIC COMPONENT PACKAGED STRUCTURE"

GENEVA, Jan. 27 -- KYOCERA CORPORATION (6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto6128501), 京セラ株式会社 (京都府京都... Read More


INTERNATIONAL PATENT: HORIBA, LTD., 株式会社堀場製作所 FILES APPLICATION FOR "ANALYSIS SYSTEM, INFORMATION PROCESSING SYSTEM, CONTROL DEVICE AND COMPUTER PROGRAM"

GENEVA, Jan. 27 -- HORIBA, LTD. (2, Miyanohigashicho, Kisshoin, Minami-ku, Kyoto-shi, Kyoto6018510), 株式会社堀場製作所 (京都府&... Read More


INTERNATIONAL PATENT: NTN CORPORATION, NTN株式会社 FILES APPLICATION FOR "METHOD FOR PRODUCING CELL TISSUE"

GENEVA, Jan. 27 -- NTN CORPORATION (3-6-32, Nakanoshima, Kita-ku, Osaka-shi, Osaka5300005), NTN株式会社 (大阪府大阪市&#... Read More