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US Patent Issued to Monolithic 3D on June 23 for "3D semiconductor devices and structures with logic and memory, and a semiconductor die" (American, Israeli Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,619, issued on June 23, was assigned to Monolithic 3D Inc. (Allen, Texas). "3D semiconductor devices and structures with logic and memory, ... Read More


US Patent Issued to SK hynix on June 23 for "Semiconductor device and manufacturing method of a semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,620, issued on June 23, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor device and manufacturing method of a semic... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Semiconductor device structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,621, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device structure ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Non-volatile memory device and system including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,622, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Non-volatile memory device and system includ... Read More


US Patent Issued to SK hynix on June 23 for "Semiconductor device and method of manufacturing semiconductor device" (South Korean Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,623, issued on June 23, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor device and method of manufacturing semicon... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Method of forming a memory cell having an offset interconnect via extending through a hard mask with variable thickness" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,624, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method of forming a memory cell hav... Read More


US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Semiconductor device and data storage system including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,625, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device and data storage system... Read More


US Patent Issued to UNITED MICROELECTRONICS on June 23 for "MRAM circuit and layout" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,626, issued on June 23, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "MRAM circuit and layout" was invented by Ti... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Memory device and method of forming the same and integrated circuit" (American, Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,627, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Memory device and method of forming... Read More


US Patent Issued to Kioxia on June 23 for "Nonvolatile semiconductor storage device and manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,628, issued on June 23, was assigned to Kioxia Corp. (Tokyo). "Nonvolatile semiconductor storage device and manufacturing method" was inven... Read More