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US Patent Issued to Modine on June 23 for "Liquid immersion cooling platform and components thereof" (Texas Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,569, issued on June 23, was assigned to Modine LLC (Racine, Wis.). "Liquid immersion cooling platform and components thereof" was invented ... Read More


US Patent Issued to Predictive Thermal Systems on June 23 for "Integrated two-phase immersion cooling system with enhanced boiling and predictive fluid and condensation control" (Oregon Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,570, issued on June 23, was assigned to Predictive Thermal Systems LLC (Stayton, Ore.). "Integrated two-phase immersion cooling system with... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Fluid collecting apparatus, cooling system and method of operating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,571, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Fluid collecting apparatus, coo... Read More


US Patent Issued to PSIQUANTUM on June 23 for "Cryogenic data center rack" (Washington, California Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,572, issued on June 23, was assigned to PSIQUANTUM CORP. (Palo Alto, Calif.). "Cryogenic data center rack" was invented by Hong Hu (Bothell... Read More


US Patent Issued to Huawei Technologies on June 23 for "Heat dissipation apparatus and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,573, issued on June 23, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "Heat dissipation apparatus and electronic device" ... Read More


US Patent Issued to Intel on June 23 for "Multilayer back plate with molded ceramic layer" (Oregon, Washington Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,574, issued on June 23, was assigned to Intel Corp. (Santa Clara, Calif.). "Multilayer back plate with molded ceramic layer" was invented b... Read More


US Patent Issued to Nortek Air Solutions Canada on June 23 for "Blended operation mode for providing cooling to a heat load" (Canadian Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,575, issued on June 23, was assigned to Nortek Air Solutions Canada Inc. (Saskatoon, Canada). "Blended operation mode for providing cooling... Read More


US Patent Issued to Ciena on June 23 for "Angled and stepped faceplate for telecommunications and networking shelf and circuit packs" (Canadian Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,576, issued on June 23, was assigned to Ciena Corp. (Hanover, Md.). "Angled and stepped faceplate for telecommunications and networking she... Read More


US Patent Issued to Fulian Precision Electronics (Tianjin) on June 23 for "Method for controlling heat dissipation fan and related apparatus" (Chinese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,577, issued on June 23, was assigned to Fulian Precision Electronics (Tianjin) Co. LTD. (Tianjin, China). "Method for controlling heat diss... Read More


US Patent Issued to Sandisk Technologies on June 23 for "Server thermal management" (Malaysian Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,578, issued on June 23, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Server thermal management" was invented by Tew Wei H... Read More