ALEXANDRIA, Va., Aug. 18 -- United States Patent no. RE51,003, issued on Aug. 18, was assigned to FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. (Munich). "Apparatus, method an... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. RE51,004, issued on Aug. 18, was assigned to FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. (Munich). "Apparatus, method an... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. RE51,005, issued on Aug. 18, was assigned to Kioxia Corp. (Tokyo). "Multi-chip package and memory system" was invented by Naoki Matsunaga (Tokyo).... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. RE51,006, issued on Aug. 18, was assigned to LG Electronics Inc. (Seoul, South Korea). "Method for determining result of transmission for contenti... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. RE51,007, issued on Aug. 18, was assigned to NetScout Systems Inc. (Westford, Mass.). "Optimizing radio cell quality for capacity and quality of s... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. RE51,008, issued on Aug. 18, was assigned to Sony Group Corp. (Tokyo). "User equipment, network node and radio communication method" was invented ... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. RE51,009, issued on Aug. 18, was assigned to Adeia Semiconductor Solutions LLC (San Jose, Calif.). "Fabrication of nano-sheet transistors with dif... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. RE51,010, issued on Aug. 18, was assigned to Sony Group Corp. (Tokyo). "Semiconductor integrated circuit" was invented by Yoshinori Tanaka (Tokyo)... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. RE51,011, issued on Aug. 18, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Organic light emitting display device and method ... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,708,060, issued on Aug. 18, was assigned to Tribine Industries LLC (Logansport, Ind.). "Articulated combine having rear module with seedbed pre... Read More