GENEVA, Oct. 30 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2026/081944) for “INTEGRATED MILLIMETER WAVE (IMMW) PPDU FORMAT”. With publication no. WO/2026/223242, here are the other... Read More
GENEVA, Oct. 30 -- NINGBO SUNNY OPOTECH CO., LTD filed a patent application (CN2026/081959) for “GIMBAL ASSEMBLY AND GIMBAL MODULE”. With publication no. WO/2026/223243, here are the other details rel... Read More
GENEVA, Oct. 30 -- BOE TECHNOLOGY GROUP CO., LTD. filed a patent application (CN2026/082159) for “DISPLAY SUBSTRATE, DISPLAY PANEL AND DISPLAY APPARATUS”. With publication no. WO/2026/223244, here are... Read More
GENEVA, Oct. 30 -- GUANGZHOU AUTOMOBILE GROUP CO., LTD. filed a patent application (CN2026/081427) for “LOCKING CONTROL METHOD AND APPARATUS FOR VEHICLE, ELECTRONIC DEVICE, AND STORAGE MEDIUM”. With p... Read More
GENEVA, Oct. 30 -- ZHEJIANG ZEEKR INTELLIGENT TECHNOLOGY CO., LTD. filed a patent application (CN2026/081555) for “VEHICLE TAIL LAMP AND VEHICLE”. With publication no. WO/2026/223238, here are the oth... Read More
GENEVA, Oct. 30 -- JETLINE AVIATION (SHANGHAI) CO., LTD. filed a patent application (CN2026/081883) for “AVIATION POSITIONING METHOD BASED ON INERTIAL NAVIGATION”. With publication no. WO/2026/223240,... Read More
GENEVA, Oct. 30 -- ACM RESEARCH (SHANGHAI) , INC. filed a patent application (CN2026/081041) for “SUBSTRATE SUPPORTING APPARATUS AND SUBSTRATE PROCESSING DEVICE”. With publication no. WO/2026/223233, ... Read More
GENEVA, Oct. 30 -- CHINA CONSTRUCTION INDUSTRIAL & ENERGY ENGINEERING GROUP CO., LTD. filed a patent application (CN2026/081237) for “INTELLIGENT TIGHTENING DEVICE FOR DUCT FLANGE IN CONFINED SPACE AN... Read More
GENEVA, Oct. 30 -- ZTE CORPORATION filed a patent application (CN2026/081275) for “DATA PROCESSING METHOD, COMMUNICATION NODE, AND STORAGE MEDIUM”. With publication no. WO/2026/223235, here are the ot... Read More
GENEVA, Oct. 30 -- DBVISION (NINGBO) COMMUNICATION TECHNOLOGY CO., LTD. filed a patent application (CN2026/080949) for “CHIP MODULE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD FOR CHIP MODULE”. With ... Read More