ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,974, issued on April 7, was assigned to XINTEC INC. (Taoyuan City, Taiwan). "Chip package and manufacturing method thereof" was invented by... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,975, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Integrated circuit device" was invented by J... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,976, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device" was invented by Jeo... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,977, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Fill of vias in single and dual damascene structures using self... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,978, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a source/drain c... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,979, issued on April 7, was assigned to Apple Inc. (Cupertino, Calif.). "Dual contact and power rail for high performance standard cells" w... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,980, issued on April 7, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Front end of line processing compatible ther... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,981, issued on April 7, was assigned to QUALCOMM Inc. (San Diego). "Port landing-free low-skew signal distribution with backside metallizat... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,982, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices with insulated source/... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,983, issued on April 7, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Interconnects formed using integrated damasc... और पढ़ें