CUTTACK, India, May 19 -- Orissa High Court issued the following order on April 17: 1. The Appellant/complainant has preferred this CRLLP under Section 378 of the Code of Criminal Procedure, 1973 cha... Read More
CUTTACK, India, May 19 -- Orissa High Court issued the following order on April 17: 1. The Appellant has filed the instant CRLLP under Section 378(4) of the Code of Criminal Procedure, 1973/ Section ... Read More
CUTTACK, India, May 19 -- Orissa High Court issued the following order on April 17: 1. The Appellant, in CRLA, assails the judgment of conviction and order of sentence dated 25.03.2025, passed by the... Read More
CUTTACK, India, May 19 -- Orissa High Court issued the following order on April 17: 1. The Convicts/Appellants, in this CRLA, assail the judgment of conviction dated 24.12.2024 and order of sentence ... Read More
CUTTACK, India, May 19 -- Orissa High Court issued the following order on April 17: The Petitioner has filed the instant Criminal Appeal under Section 374(2) of the Code of Criminal Procedure, 1973/ ... Read More
ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,105, issued on May 19, was assigned to Dell Products LP (Round Rock, Texas). "Compute-on-fan-tray-assembly (COFTA) system" was invented by N... Read More
ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,106, issued on May 19, was assigned to The University of Sydney (Sydney). "Apparatus for air measurements" was invented by Oliver Jay (Sydne... Read More
ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,108, issued on May 19, was assigned to ASIA VITAL COMPONENTS (CHINA) Co. LTD. (Shenzhen, China). "Fan control system and method" was invente... Read More
ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,109, issued on May 19, was assigned to MintGreen Blockchain Innovation Corp. (Burnaby, Canada). "Heat recovery from computer components" was... Read More
ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,110, issued on May 19, was assigned to Crystal Group Inc. (Hiawatha, Iowa). "Dual inline memory module heat sink for conduction cooled envir... Read More