ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,055, issued on April 14, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-do, South Korea). "Display device including a sweep driver tha... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,056, issued on April 14, was assigned to BOE Technology Group Co. Ltd. (Beijing). "Data driving integrated circuit, display apparatus, and... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,057, issued on April 14, was assigned to Samsung Display Co. Ltd. (Yongin-Si, South Korea). "Display device" was invented by Sang Yong No ... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,058, issued on April 14, was assigned to Innolux Corp. (Miaoli County, Taiwan). "Electronic device" was invented by Shuhei Hosaka (Miaoli ... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,059, issued on April 14, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Display device" was invented by Jaehoon Lee (... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,060, issued on April 14, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Display device" was invented by Mangyu Park (Paju-si, ... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,778, issued on April 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Electronic device" was invented by Takashi Iwamoto... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,778, issued on April 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Electronic device" was invented by Takashi Iwamoto... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,779, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufa... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,779, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufa... और पढ़ें