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US Patent Issued to FUJIFILM on March 3 for "Image analysis processing apparatus, endoscope system, operation method of image analysis processing apparatus, and non-transitory computer readable medium" (Japanese Inventor)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,564,307, issued on March 3, was assigned to FUJIFILM Corp. (Tokyo). "Image analysis processing apparatus, endoscope system, operation method of... Read More


US Patent Issued to DePuy Ireland UnLtd. on March 3 for "Hybrid fixation features for three-dimensional porous structures for bone ingrowth and methods for producing" (Indiana Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,564,496, issued on March 3, was assigned to DePuy Ireland UnLtd. Co. (Ringaskiddy, Ireland). "Hybrid fixation features for three-dimensional po... Read More


US Patent Issued to DENSO on March 3 for "Distance measurement device" (Japanese Inventor)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,265, issued on March 3, was assigned to DENSO Corp. (Kariya, Japan). "Distance measurement device" was invented by Koki Hayashi (Kariya, Ja... Read More


US Patent Issued to Intel on March 3 for "High density cable structure and wire termination" (Oregon Inventor)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,567,694, issued on March 3, was assigned to Intel Corp. (Santa Clara, Calif.). "High density cable structure and wire termination" was invented... Read More


US Patent Issued to QUALCOMM on March 3 for "Scheduling of an uplink transmission of multiple transport blocks" (California Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,491, issued on March 3, was assigned to QUALCOMM Inc. (San Diego). "Scheduling of an uplink transmission of multiple transport blocks" was ... Read More


US Patent Issued to S & J INDUSTRIES on March 3 for "Ice pack" (Chinese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. D1,115,871, issued on March 3, was assigned to S & J INDUSTRIES Ltd. (Hong Kong). "Ice pack" was invented by Dequan Lin (Xiamen, China), Yun Zhang... Read More


US Patent Issued to S & J INDUSTRIES on March 3 for "Ice pack" (Chinese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. D1,115,872, issued on March 3, was assigned to S & J INDUSTRIES Ltd. (Hong Kong). "Ice pack" was invented by Dequan Lin (Xiamen, China), Yun Zhang... Read More


US Patent Issued to DJO on March 3 for "Walking boot, chafe assembly, protective rim for a push-button release valve and related methods" (California Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,564,507, issued on March 3, was assigned to DJO LLC (Carlsbad, Calif.). "Walking boot, chafe assembly, protective rim for a push-button release... Read More


US Patent Issued to NXP on March 3 for "Temperature sensor circuits" (Dutch Inventor)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,096, issued on March 3, was assigned to NXP B.V. (Eindhoven, Netherlands). "Temperature sensor circuits" was invented by Peter van der Camm... Read More


US Patent Issued to Taravu on March 3 for "Optimising computer program code" (British Inventor)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,597, issued on March 3, was assigned to Taravu Ltd. (London). "Optimising computer program code" was invented by Pressenna Sockalingasamy (... Read More