ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,723, issued on Oct. 6, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and metho... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,724, issued on Oct. 6, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Method for preparing semiconductor device with air... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,725, issued on Oct. 6, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with composite dielectric and... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,726, issued on Oct. 6, was assigned to LAPIS SEMICONDUCTOR Co. LTD. (Yokohama, Japan). "Semiconductor device and semiconductor device fabric... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,727, issued on Oct. 6, was assigned to GLOBALFOUNDRIES U.S. Inc. (Malta, N.Y.). "Inductor structures integrated in semiconductor devices" wa... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,728, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and methods of f... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,730, issued on Oct. 6. "Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integration" was invented ... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,731, issued on Oct. 6, was assigned to Siemens AG (Munich). "Arrangement for cooling and motor module" was invented by Lutz Namyslo (Hausen,... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,732, issued on Oct. 6, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Bonding layers formed of high thermal conductivity mat... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,734, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structures and methods of man... Read More