GENEVA, Oct. 5 -- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. filed a patent application (JP2026/006451) for “ENERGY AMOUNT CALCULATION METHOD AND ENERGY AMOUNT CALCULATION PROGRAM”. With pub... Read More
GENEVA, Oct. 5 -- SHARP KABUSHIKI KAISHA filed a patent application (JP2026/006518) for “SPEECH CONVERSATION SYSTEM”. With publication no. WO/2026/204024, here are the other details related to the pat... Read More
GENEVA, Oct. 5 -- MIURA CO., LTD. filed a patent application (JP2026/006379) for “BOILER AND COMPOSITE BOILER”. With publication no. WO/2026/204017, here are the other details related to the patent ap... Read More
GENEVA, Oct. 5 -- KAWASAKI JUKOGYO KABUSHIKI KAISHA filed a patent application (JP2026/006390) for “FASTENER STORAGE CARTRIDGE”. With publication no. WO/2026/204018, here are the other details related... Read More
GENEVA, Oct. 5 -- SOFTBANK CORP. filed a patent application (JP2026/006402) for “BEAM SPLITTER AND COMMUNICATION DEVICE”. With publication no. WO/2026/204019, here are the other details related to the... Read More
GENEVA, Oct. 5 -- JAPAN COMPOSITE CO., LTD. filed a patent application (JP2026/006444) for “MOLDING MATERIAL AND MOLDED ARTICLE”. With publication no. WO/2026/204020, here are the other details relate... Read More
GENEVA, Oct. 5 -- HITACHI HIGH-TECH CORPORATION filed a patent application (JP2026/006359) for “RADIOTHERAPY PATIENT MANAGEMENT DEVICE, RADIOTHERAPY PATIENT MANAGEMENT METHOD, AND RADIOTHERAPY PATIENT... Read More
GENEVA, Oct. 5 -- TAMURA CORPORATION filed a patent application (JP2026/006363) for “POLYAMIC ACID, POLYAMIC ACID COMPOSITION, POLYMIDE, POLYMIDE FILM, COPPER FOIL WITH RESIN, MULTILAYER WIRING BOARD,... Read More
GENEVA, Oct. 5 -- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. filed a patent application (JP2026/006374) for “SEMICONDUCTOR CHIP”. With publication no. WO/2026/204016, here are the other deta... Read More
GENEVA, Oct. 5 -- TAMURA CORPORATION filed a patent application (JP2026/006335) for “RESIN COMPOSITION, CURED PRODUCT, POLYIMIDE FILM, MULTILAYER WIRING BOARD, COPPER FOIL WITH RESIN, COIL STRUCTURE, ... Read More