Japan, Nov. 10 -- TRY ENGINEERING CO LTD has got intellectual property rights for 'ROBOT DEVICE.' Other related details are as follows: Application Number: JP,2023-102966 Category (FI): B25J17/02@J,... Read More
Japan, Nov. 10 -- TOSEI CORP has got intellectual property rights for 'DRYER FOR MAT-LIKE MEMBER.' Other related details are as follows: Application Number: JP,2024-175778 Category (FI): D06F58/00@A... Read More
Japan, Nov. 10 -- YUPITERU CORP has got intellectual property rights for 'SYSTEM AND PROGRAM AND THE LIKE.' Other related details are as follows: Application Number: JP,2024-172054 Category (FI): G0... Read More
Japan, Nov. 10 -- SEMICONDUCTOR ENERGY LAB CO LTD has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2024-162197 Category (... Read More
Japan, Nov. 10 -- HITACHI HIGH-TECH CORP has got intellectual property rights for 'COLUMN CARTRIDGE.' Other related details are as follows: Application Number: JP,2024-178533 Category (FI): G01N30/4... Read More
Japan, Nov. 10 -- SEMICONDUCTOR ENERGY LAB CO LTD has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2024-177394 Category (... Read More
Japan, Nov. 10 -- TE CONNECTIVITY SOLUTIONS GMBH has got intellectual property rights for 'HOUSING ASSEMBLY FOR MODULAR CONNECTOR WITH PRE-LOCKING SCREW.' Other related details are as follows: Applic... Read More
Japan, Nov. 10 -- MINAMI MAKOTO has got intellectual property rights for 'SOCKS.' Other related details are as follows: Application Number: JP,2023-098087 Category (FI): A41B11/00,101@Z,A41B11/00@A,... Read More
Japan, Nov. 10 -- HEIWA CORP has got intellectual property rights for 'GAME MACHINE.' Other related details are as follows: Application Number: JP,2023-097344 Category (FI): A63F7/02,320 Stage: Gra... Read More
Japan, Nov. 10 -- NIDEC INSTRUMENTS CORP has got intellectual property rights for 'MOTOR AND PUMP DEVICE.' Other related details are as follows: Application Number: JP,2024-166607 Category (FI): H02... Read More