Japan, July 1 -- MURATA MFG CO LTD has got intellectual property rights for 'MULTILAYER CERAMIC CAPACITOR.' Other related details are as follows: Application Number: JP,2025-014007 Category (FI): H0... Read More
Japan, July 1 -- NEC CORP has got intellectual property rights for 'SELLING PRICE MANAGEMENT DEVICE, CONTROL METHOD, AND PROGRAM.' Other related details are as follows: Application Number: JP,2025-01... Read More
Japan, July 1 -- KAKEHASHI:KK has got intellectual property rights for 'DEVICE, METHOD AND PROGRAM FOR CONTINUOUSLY RECORDING MEDICATION STATE OF PATIENT.' Other related details are as follows: Appli... Read More
Japan, July 1 -- XENCOR INC has got intellectual property rights for 'HETERODIMERIC ANTIBODIES THAT BIND ENPP3 AND CD3.' Other related details are as follows: Application Number: JP,2024-228835 Cate... Read More
Japan, July 1 -- PANASONIC INTELLECTUAL PROPERTY CORP OF AMERICA has got intellectual property rights for 'THREE-DIMENSIONAL DATA ENCODING METHOD, THREE-DIMENSIONAL DATA DECODING METHOD, THREE-DIMENSI... Read More
Japan, July 1 -- SAKODA KOTA has got intellectual property rights for 'VACUUM SOUNDPROOFING THERMAL INSULATOR, AND METHOD FOR MANUFACTURING THE SAME.' Other related details are as follows: Applicatio... Read More
Japan, July 1 -- KDDI CORP has got intellectual property rights for 'LINK ADAPTATION METHOD AND DEVICE.' Other related details are as follows: Application Number: JP,2023-170117 Category (FI): H04W2... Read More
Japan, July 1 -- ABSOLICS INC has got intellectual property rights for 'PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING ELEMENT PACKAGE, AND METHOD FOR MANUFACTURING PACKAGING SUBSTRATE.' Other related ... Read More
Japan, July 1 -- DAIFUKU CO LTD has got intellectual property rights for 'ARTICLE CARRYING FACILITY.' Other related details are as follows: Application Number: JP,2023-166386 Category (FI): G05D1/43... Read More
Japan, July 1 -- KDDI CORP has got intellectual property rights for 'WIRELESS DEVICE, BASE STATION DEVICE, NETWORK NODE AND PROGRAM.' Other related details are as follows: Application Number: JP,2023... Read More