US Patent Issued to Hewlett Packard Enterprise Development on May 19 for "Apparatuses, systems, and methods for mounting chassis in a short depth server rack" (Indian Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,113, issued on May 19, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas). "Apparatuses, systems, and methods for mou... Read More

US Patent Issued to ROHM on May 19 for "Intelligent power module, electric vehicle or hybrid vehicle, and method of assembling intelligent power module" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,114, issued on May 19, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Intelligent power module, electric vehicle or hybrid vehicle, and meth... Read More

US Patent Issued to Wacker Neuson Produktion on May 19 for "Electrical work machine having a cooled battery" (German, Austrian Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,115, issued on May 19, was assigned to Wacker Neuson Produktion GmbH & Co. (Reichertshofen, Germany). "Electrical work machine having a cool... Read More

US Patent Issued to FUJI ELECTRIC on May 19 for "Power conversion device" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,116, issued on May 19, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Power conversion device" was invented by Toshiaki Azuma (A... Read More

US Patent Issued to SWITCH PROJECT on May 19 for "EMF shield" (California Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,118, issued on May 19, was assigned to SWITCH PROJECT LLC (Woodland Hills, Calif.). "EMF shield" was invented by Ben Salem (Woodland Hills, ... Read More

US Patent Issued to GROUP UP INDUSTRIAL on May 19 for "Elastic clamping structure and substrate carrier" (Taiwanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,119, issued on May 19, was assigned to GROUP UP INDUSTRIAL Co. LTD. (Taoyuan City, Taiwan). "Elastic clamping structure and substrate carrie... Read More

US Patent Issued to MURATA MANUFACTURING on May 19 for "Wireless communication device manufacturing method and wireless communication device manufacturing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,120, issued on May 19, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Wireless communication device manufacturing metho... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on May 19 for "Memory device, and method for forming thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,121, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Memory device, and method for forming... Read More

US Patent Issued to Atomera on May 19 for "Multi-chip memory system including DRAM chips with integrated comparator arrays and method of operating same" (Texas Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,122, issued on May 19, was assigned to Atomera Inc. (Los Gatos, Calif.). "Multi-chip memory system including DRAM chips with integrated comp... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,123, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device and method of fabricating... Read More

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