INTERNATIONAL PATENT: LANDMARK GRAPHICS CORPORATION FILES APPLICATION FOR "WELLBORE HOLE PROFILE DETERMINATION"

GENEVA, Dec. 23 -- LANDMARK GRAPHICS CORPORATION (3000 N. Sam Houston Pkwy E.Houston, Texas 77032-3219) filed a patent application (PCT/US2024/033317) for "WELLBORE HOLE PROFILE DETERMINATION" on Jun ... Read More

INTERNATIONAL PATENT: GOOGLE LLC FILES APPLICATION FOR "CONTEXT AWARE FRAME INSERTION"

GENEVA, Dec. 23 -- GOOGLE LLC (1600 Amphitheatre ParkwayMountain view, California 94043) filed a patent application (PCT/US2024/033381) for "CONTEXT AWARE FRAME INSERTION" on Jun 11, 2024. With public... Read More

INTERNATIONAL PATENT: SANDISK TECHNOLOGIES, INC. FILES APPLICATION FOR "THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRUCTURES AND METHODS FOR FORMING THE SAME"

GENEVA, Dec. 23 -- SANDISK TECHNOLOGIES, INC. (951 Sandisk DriveMilpitas, California 95035) filed a patent application (PCT/US2024/056048) for "THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTA... Read More

INTERNATIONAL PATENT: ALLEGRO MICROSYSTEMS, LLC FILES APPLICATION FOR "TUNNEL MAGNETORESISTANCE ELEMENT AND SENSOR HAVING INCREASED MEASUREMENT RANGE"

GENEVA, Dec. 23 -- ALLEGRO MICROSYSTEMS, LLC (955 Perimeter RoadManchester, NH 03103-3353) filed a patent application (PCT/US2025/015353) for "TUNNEL MAGNETORESISTANCE ELEMENT AND SENSOR HAVING INCREA... Read More

INTERNATIONAL PATENT: FORD OTOMOTIV SANAYI A.S. FILES APPLICATION FOR "A SUSPENSION COMPONENT"

GENEVA, Dec. 23 -- FORD OTOMOTIV SANAYI A.S. (Akpinar Mahallesi Hasan Basri Caddesi No:234885 Sancaktepe/Istanbul) filed a patent application (PCT/TR2025/050357) for "A SUSPENSION COMPONENT" on Apr 15... Read More

INTERNATIONAL PATENT: SANDISK TECHNOLOGIES, INC. FILES APPLICATION FOR "THREE-DIMENSIONAL MEMORY CONTAINING ETCH-STOP ISOLATION CAPS OVER LATERAL ISOLATION STRUCTURES AND METHOD OF MAKING THE SAME"

GENEVA, Dec. 23 -- SANDISK TECHNOLOGIES, INC. (951 SanDisk DriveMilpitas, California 95035) filed a patent application (PCT/US2025/011247) for "THREE-DIMENSIONAL MEMORY CONTAINING ETCH-STOP ISOLATION ... Read More

INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "CIRCUITS FOR CONNECTING HIGH-BANDWIDTH MEMORY CUBES TO A HOST DEVICE AND ASSOCIATED SYSTEMS AND METHODS"

GENEVA, Dec. 23 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/030066) for "CIRCUITS FOR CONNECTING HIGH-BANDWIDTH MEMORY CUBES... Read More

INTERNATIONAL PATENT: ZAZZLE INC. FILES APPLICATION FOR "CONTAINERS FOR STORING AND TRANSMITTING REPRESENTATIONS OF CUSTOMIZABLE PRODUCTS"

GENEVA, Dec. 23 -- ZAZZLE INC. (1200 Chestnut St.Menlo Park, California 94025) filed a patent application (PCT/US2025/019010) for "CONTAINERS FOR STORING AND TRANSMITTING REPRESENTATIONS OF CUSTOMIZAB... Read More

INTERNATIONAL PATENT: ST. JUDE MEDICAL, CARDIOLOGY DIVISION, INC. FILES APPLICATION FOR "METHODS FOR ACHIEVING CONSISTENT CRIMP PROFILE"

GENEVA, Dec. 23 -- ST. JUDE MEDICAL, CARDIOLOGY DIVISION, INC. (177 East County Road BSt. Paul, Minnesota 55117) filed a patent application (PCT/US2025/020898) for "METHODS FOR ACHIEVING CONSISTENT CR... Read More

INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "HIGH-BANDWIDTH MEMORY (HBM) PACKAGE-ON-PACKAGE (POP) DYNAMIC RANDOM-ACCESS MEMORY (DRAM) WITH SEMICONDUCTOR PILLARS"

GENEVA, Dec. 23 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/023723) for "HIGH-BANDWIDTH ... Read More

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