Indonesia, April 20 -- Through the collaboration, Silicon Box will work with industry leaders to advance automotive-grade chiplet devices with advanced packaging.

Singapore (ANTARA/PRNewswire)- Silicon Box, an industry leader in advanced semiconductor packaging solutions, today announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles. Chiplet technology is recognized as a critical solution to address rising costs and bottlenecks amidst rapidly increasing computing requirements for modern, software-defined vehicles. Silicon Box will support the ACP's research initiative w...