INTERNATIONAL PATENT: CHENGDU DESAY SV KAWA TECHNOLOGY CO., LTD., 成都市德赛西威卡蛙科技有限公司 FILES APPLICATION FOR "ON-BOARD INTERCONNECTION METHOD AND APPARATUS AND ELECTRONIC DEVICE AND STORAGE MEDIUM"

Posted On: 2026-05-09

GENEVA, May 9 -- CHENGDU DESAY SV KAWA TECHNOLOGY CO., LTD. (1st To 5th Floors, Building 2, No. 171, Hele 2nd Street, Chengdu High-Tech Zone, China (Sichuan) Pilot Free Trade ZoneChengdu, Sichuan 610000), 成都市德赛西威卡蛙科技有限公司 (中国四川省成都市中国（四川）自由贸易试验区成都高新区和乐二街171号2栋1-5层) filed a patent application (PCT/CN2025/104759) for "ON-BOARD INTERCONNECTION METHOD AND APPARATUS, AND ELECTRONIC DEVICE AND STORAGE MEDIUM" on Jun 27...

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इस लेख के रीप्रिंट को खरीदने या इस प्रकाशन का पूरा फ़ीड प्राप्त करने के लिए, कृपया हमे संपर्क करें.

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INTERNATIONAL PATENT: CHENGDU DESAY SV KAWA TECHNOLOGY CO., LTD., 成都市德赛西威卡蛙科技有限公司 FILES APPLICATION FOR "ON-BOARD INTERCONNECTION METHOD AND APPARATUS AND ELECTRONIC DEVICE AND STORAGE MEDIUM"