INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "MULTILAYER SHEET MATERIAL AND METHOD FOR PRODUCING SAME"

GENEVA, May 6 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2023/037451) for "MULTILAYER SHEET MATERIAL AND METHOD FOR PRODUCING SAME" on Oct 16, 2023. With publication no. WO/2024/090280, the details related to the patent application was published on May 02, 2024.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TOYOMURA Kyouichi (c/o DIC Corpo...